The Printed Circuit Board Lab designs the physical substrate board of the electronic units manufactured by INTRACOM TELECOM. Due to product manufacturing and operational requirements, the design becomes an integral part of product-specific know-how.
The company also invests in PCB simulation software in order to achieve timely fault identification during PCB design, resulting in fewer redesigns and accelerated development.
The Lab continuously targets on improving infrastructure organization in order to reduce development time-and on designing products incorporating new materials, such as Fine Pitch QFPs & QFNs, BGA, Mbga, Unpackaged Wire Bonded Dies. There is an ongoing effort in order the laboratory to be always updated with the latest hardware and software. The last hardware update take place in 2015 and it was new work station for every CAD designer.
The NPI Laboratory occupies an area of 1000 sq m located in the same premises with R&D facilities.
NPI Laboratory main activities are:
Manufacturing services to customers who need prototypes and small volume production of pcba's as well as fully assembled products can be provided by the NPI Lab.
NPI Lab Equipment includes:
The Printed Circuit Board Lab produces highly reliable and quick-turnover board prototypes and low volume production pcb quantities.
Single sided / Double sided Plated Through & MultiLayer (up to 20 layers) boards are manufactured. Blind Via technology is supported.
Various base materials are used such as FR4i, PCL370HR for standard technology boards, BT Epoxy, Polyimide for specific application boards and Rogers, Taconic for RF & Microwave boards.
Lab Testing facilities include Automatic Optical Inspection, X-ray analysis, Electrical Testing, Metallographic Inspection, & Solderability tests.
Mechanical Engineering Lab occupies an area of 700 sq m located next to R&D facilities.
Main activities of the Mechanical Lab are:
The Mechanical lab supports processes such as:
Mechanical Lab Equipment includes: